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Accurate Modeling of Packages and Interconnects

An important step in high frequency / high speed IC design is the characterization of IC performance within a realistic environment including packaging, interconnects, connectors, etc. There are several approaches to creating accurate models of these elements, such as creating equivalent circuit models, EM simulations, and measurements. This webcast will compare these different methods and examine the trade-offs of each. Several case studies are presented that compare measured and simulated results.
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